HCTS393K 查看數據表（PDF） - Intersil

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HCTS393K

Radiation Hardened Dual 4-Stage Binary Counter

Intersil 

Die Characteristics

DIE DIMENSIONS:

86 x 86 mils

METALLIZATION:

Type: AlSi

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 mils x 4 mils

Metallization Mask Layout

HCTS393MS

HCTS393MS

Q0 1 (3)

NC

Q1 1 (4)

(11) 2 Q0

NC

(10) 2 Q1

NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.

The mask series for the HCTS393 is TA14490A.

Spec Number 518633

680

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