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BLF245 查看數據表(PDF) - NXP Semiconductors.

零件编号
产品描述 (功能)
比赛名单
BLF245
NXP
NXP Semiconductors. NXP
BLF245 Datasheet PDF : 16 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Philips Semiconductors
VHF power MOS transistor
Product specification
BLF245
handbook, full pagewidth
135
copper straps
rivets
72
copper strap
copper straps
+VGG
C3
C4
R2
R1
C1
C2
L1
L2
L5
+VDD
C5
C6
L4
R3
C8
L3
L6 C7
C9
C10
MGP175
Dimensions in mm.
The circuit and components are situated on one side of the epoxy fibre-glass board; the other side is unetched copper and serves as an earth. Earth
connections are made by means of fixing screws, hollow rivets and copper straps under the sources and around the edges, to provide a direct contact
between the copper on the component side and the ground plane.
Fig.14 Component layout for 175 MHz class-B test circuit.
2003 Sep 02
10

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