LPC47N227-MV 查看數據表（PDF） - SMSC -> Microchip
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LPC47N227-MV Datasheet PDF : 5 Pages
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100 Pin Super I/O with LPC Interface for Notebook Applications
(ddd)
FIGURE 2 – 100 PIN STQN LEAD-FREE PACKAGE OUTLINE
MIN
NOMINAL
MAX
A
~
~
1.60
A1
0.05
~
0.15
A2
1.35
1.40
1.45
D
13.80
14.00
14.20
D/2
6.90
7.00
7.10
D1
11.80
12.00
12.20
E
13.80
14.00
14.20
E/2
6.90
7.00
7.10
E1
11.80
12.00
12.20
H
0.09
~
0.20
L
0.45
0.60
0.75
L1
~
1.00
~
e
0.40 Basic
θ
0o
3.5o
7o
W
0.13
0.16
0.23
R1
0.08
~
~
R2
0.08
~
0.20
ccc
~
~
.0762
ccc
~
~
0.08
ddd
~
~
0.035
REMARK
Overall Package Height
Standoff
Body Thickness
X Span
1/2 X Span Measure from Centerline
X body Size
Y Span
1/2 Y Span Measure from Centerline
Y body Size
Lead Frame Thickness
Lead Foot Length from Centerline
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity (Assemblers)
Coplanarity (Test House)
True Position Spread (Bent Leads)
Notes:
1 Controlling Unit: millimeter
2 Minimum space between protrusion and an adjacent lead is .007 mm.
3 Details of pin 1 identifier are optional but must be located within the zone indicated.
4 Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5 Shoulder widths must conform to JEDEC MS-026 dimension 'S' of a minimum of 0.20mm.
SMSC DB – LPC47N227
Page 5
PRODUCT PREVIEW
Rev. 03-29-07
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