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STPS1H100 查看數據表(PDF) - STMicroelectronics

零件编号
产品描述 (功能)
比赛名单
STPS1H100
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STPS1H100 Datasheet PDF : 10 Pages
1 2 3 4 5 6 7 8 9 10
Package information
2
Package information
STPS1H100
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at www.st.com.
Figure 17. SMA package dimensions
E1
D
E
A1
C
A2
L
b
Dimensions
Ref
Millimeters
Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.094
A2 0.05 0.20 0.002 0.008
b
1.25 1.65 0.049 0.065
c
0.15 0.40 0.006 0.016
D
2.25 2.90 0.089 0.114
E
4.80 5.35 0.189 0.211
E1 3.95 4.60 0.156 0.181
L
0.75 1.50 0.030 0.059
Figure 18. SMA footprint dimensions in Figure 19. Marking information
millimeters (inches)
1.4
(0.055)
2.63
(0.103)
5.43
(0.214)
1.4
(0.055)
1.64
(0.064)
Cathode bar (unidirectional devices only )
e3
xxx
z y ww
e3: ECOPACK ( Leadfree)
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
6/10

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