HM-6551883 查看數據表（PDF） - Intersil

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HM-6551883

256 x 4 CMOS RAM

Intersil 

Die Characteristics

DIE DIMENSIONS:

132 x 160 x 19 ±1mils

METALLIZATION:

Type: Si - Al

Thickness: 11kÅ ±2kÅ

GLASSIVATION:

Type: SiO2

Thickness: 8kÅ ±1kÅ

Metallization Mask Layout

S1

W

A4

HM-6551/883

WORST CASE CURRENT DENSITY:

1.337 x 105 A/cm2

LEAD TEMPERATURE (10s soldering):

≤300oC

HM-6551/883

E

S2

Q3 D3

Q2

D2

Q1

D1

VCC

A3

A2

A1

A0

NOTE: Pin numbers correspond to DIP Package only.

A5 A6

Q0

D0

A7 GND

9

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