AMIS-720658 查看數據表（PDF） - AMI Semiconductor

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AMIS-720658

Contact Image Sensor

AMI Semiconductor 

AMIS-720658: Contact Image Sensor

Data Sheet

4.2 Bonding Pad Layout Diagram

Figure 2 shows the bonding pad locations for the AMIS-720658 sensor.

14560µm

2290µm

SI GBST CLK

SIC

SR

VDD

VOUT

VSS

VREF

Pad Location Table

Pad

Location

SI

GBST

CLK

SIC

SR

VDD

VOUT

VSS

VREF

SO

Start Pulse

Global Start Pulse

Clock

Start Input Control

Select Resolution

Power Supply

Video Output Voltage

Ground

Reference Voltage

End of Scan Pulse

Y

X

30.0 2290.0

30.0 2637.0

30.0 3649.0

30.0 3929.0

30.0 4243.0

34.0 4850.0

30.0 5135.0

34.0 9498.0

30.0 9844.0

30.0 12190.0

Notes:

1. Definition of X and Y Pad Locations

Y

SI GBST

X

X

2. Each pad is 80um x 70um

3. All dimensions are in um

4. Die size does not include the scribe line

2370µm

335µm

SO

Figure 2: AMIS-720658 Bonding Pad Layout

AMI Semiconductor – Jul 06, M-20503-007

4

www.amis.com

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