AN-9040 查看數據表（PDF） - Fairchild Semiconductor

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AN-9040

Assembly Guidelines for Power33 Packaging

Fairchild Semiconductor 

[7] IPC J-STD-001D, “Requirements for

Soldered Electrical and Electronic

Assemblies,”

[8] IPC-SM-7525A, “Stencil Design

Guidelines,” May 2000

[9] JEDEC, JESD22-B102D, “Solderability,”

VA, Sept. 2004

[10]

Syed, Ahmer, et al, “Board Level

Assembly and Reliability Considerations

for QFN Type Packages,” Amkor

Technology, Inc., Chandler, AZ

Applicable FSIDs: FDM3622, FDM6296, FDMC2523P, FDMC2610, FDMC2674,

FDMC3300NZA, FDMC5614P, FDMC8554, FDMC8854, FDMC8878

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