BP5307 查看數據表（PDF） - ROHM Semiconductor
零件编号
产品描述 (功能)
比赛名单
BP5307 Datasheet PDF : 4 Pages
| |||
Communication ICs
FRecommended pad dimensions
BP5307
FOperation notes
The soldering used inside the unit is eguivalent to H63
solder, so it will remelt during reflow. Be sure not to sub-
ject the unit to any vibrations when passing through the
reflow furnace.
FExternal dimensions (Units: mm)
586
Share Link: 