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HLMP-ED57 查看數據表(PDF) - HP => Agilent Technologies

零件编号
产品描述 (功能)
比赛名单
HLMP-ED57 Datasheet PDF : 6 Pages
1 2 3 4 5 6
3
Package Dimensions
8.71 ± 0.20
(0.343 ± 0.008
31.60
(1.244)
MIN.
5.00 ± 0.20
(0.197 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
0.70 (0.028)
MAX.
2.35 (0.093)
MAX.
CATHODE
LEAD
1.00 MIN.
(0.039)
0.50
(0.020
±
±
0.10
0.004)
SQ.
TYP.
CATHODE
FLAT
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. LEADS ARE MILD STEEL, SOLDER DIPPED.
3. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN
EPOXY MENISCUS THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.
4. RECOMMENDED PC BOARD HOLE DIAMETERS:
LAMP PACKAGE WITHOUT STAND-OFFS: FLUSH MOUNTING AT BASE OF
LAMP PACKAGE = 1.143/1.067 (0.044/0.042).

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