MAAPGM0030-DIE 查看數據表（PDF） - Tyco Electronics
零件编号
产品描述 (功能)
比赛名单
MAAPGM0030-DIE Datasheet PDF : 6 Pages
| |||
5.0-9.0 GHz 1W Power Amplifier
RO-P-DS-3021 A 5/6
MAAPGM0030-DIE
Mechanical Information
Chip Size: 2.480 x 1.98 x 0.075 mm (98 x 78 x 3 mils)
1.980 mm
VDD
0.980 mm
0.990 mm
0.126mm.
VGG
0
0
Figure 5. Die Layout
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Bond Pad Dimensions
Pad
RF In and Out
DC Drain Supply Voltage VDD
DC Gate Supply Voltage VGG
Size (µm)
100 x 200
200 x 150
150 x 150
Size (mils)
4x8
8x6
4x6
Specifications subject to change without notice.
Email: macom_adbu_ics@tycoelectronics.com
North America: Tel. (800) 366-2266
Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
5
Visit www.macom.com for additional data sheets and product information.
Share Link: 