MC14049UB 查看數據表（PDF） - ON Semiconductor

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MC14049UB

Hex Buffers

ON Semiconductor 

16

1

Z

D

e

b

0.13 (0.005) M

MC14049UB

PACKAGE DIMENSIONS

SOEIAJ−16

F SUFFIX

PLASTIC EIAJ SOIC PACKAGE

CASE 966−01

ISSUE O

9

E HE

8

LE

Q1

M_

L

DETAIL P

VIEW P

A

c

A1

0.10 (0.004)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH OR PROTRUSIONS AND ARE MEASURED

AT THE PARTING LINE. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)

PER SIDE.

4. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

5. THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

MILLIMETERS

INCHES

DIM MIN MAX MIN MAX

A

−−− 2.05 −−− 0.081

A1 0.05 0.20 0.002 0.008

b 0.35 0.50 0.014 0.020

c 0.18 0.27 0.007 0.011

D 9.90 10.50 0.390 0.413

E 5.10 5.45 0.201 0.215

e

1.27 BSC

0.050 BSC

HE 7.40 8.20 0.291 0.323

L 0.50 0.85 0.020 0.033

LE 1.10 1.50 0.043 0.059

M

0 _ 10 _ 0 _ 10 _

Q1 0.70 0.90 0.028 0.035

Z

−−− 0.78 −−− 0.031

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