XS1000 查看數據表（PDF） - Unspecified

零件编号

产品描述 (功能)

比赛名单

XS1000

7.0-13.0 GHz GaAs MMIC 6-Bit Phase Shifter

Unspecified 

7.0-13.0 GHz GaAs MMIC

6-Bit Phase Shifter

October 2006 - Rev 17-Oct-06

Mechanical Drawing

2.104

(0.828)

0.998 1.398 1.798

(0.393) (0.550) (0.708)

0.798 1.198 1.598 1.998

(0.314) (0.472) (0.629) (0.787)

234 5678

1.267

(0.499)

1

S1000

9

1.267

(0.499)

0.0

0.0

2.973

(Note: Engineering designator is I0005360)

(1.171)

Units: millimeters (inches) Bond pad dimensions are shown to center of bond pad.

Thickness: 0.110 +/- 0.010 (0.0043 +/- 0.0004), Backside is ground, Bond Pad/Backside Metallization: Gold

All Bond Pads are 0.100 x 0.100 (0.004 x 0.004).

Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.

Dicing tolerance: +/- 0.005 (+/- 0.0002). Approximate weight: 3.88 mg.

Bond Pad #1 (RF In)

Bond Pad #2 (Input 1)

Bond Pad #3 (Input 2)

Bond Pad #4 (Input 3)

Bond Pad #5 (Vss)

Bond Pad #6 (Input 4)

Bond Pad #7 (Input 5)

Bond Pad #8 (Input 6)

Bond Pad #9 (RF Out)

Bias Arrangement

Bypass Capacitors - See App Note [2]

Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099

Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com

Page 5 of 6

Characteristic Data and Specifications are subject to change without notice. ©2006 Mimix Broadband, Inc.

Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept

their obligation to be compliant with U.S. Export Laws.

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