FEATURES:
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
• Glass passivated chip junction in Molded Plastic
package
• 1500 W surge capability at 1 ms
• Excellent clamping capability
• Low zener impedance
• Fast response time: typically less than 1.0 ps from
0 volts to BV min.
• Typical IR less than 1 uA above 10V
• High temperature soldering guaranteed: 260oC/10
seconds/.375”, [9.5mm] lead length/5lbs., [2.3kg]
tension
MECHANICAL DATA
• Case: JEDEC DO-201AE Molded plastic
• Terminals: Axial leads, solderable per
MIL-STD-202, Method 208
• Polarity Color band denoted cathode except
Bipolar
• Mounting Position: Any
• Weight: 0.045 ounce [1.2 grams]
MAXIMUM RATINGS AND CHARACTERISTICS
Rating (At 25 o C ambient temperature unless otherwise specified)
Symbol Value
Peak Power Dissipation at TA=25oC, TP=1ms (NOTE 1)
Steady State Power Dissipation at TL=75oC
Lead Lengths .375", (9.5mm) (NOTE 2)
PPK Minimum 1500
PD
5
Peak Forward Surge Current, 8.3ms Single Half Sine Wave
Superimposed on Rated Load (JEDEC Method) (NOTE3)
IFSM
200
Operating and Storage Temperature Range
NOTES:
TJ, TSTG -65 to +175
1. Non-repetitive current pulse, per Fig. 3 and derated above TA=25oC per Fig. 2
2. Mounted on Copper Leaf Area of 0.79 in2 (20mm2)
3. 8.3ms single half sine-wave, duty cycle=4 pulses per minutes maximum
Units
Watts
Watts
Amps
oC