92HD73C 查看數據表（PDF） - Integrated Device Technology

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92HD73C

SIX CHANNEL HD AUDIO CODEC

Integrated Device Technology 

92HD73C

SIX CHANNEL HD AUDIO CODEC, PREMIUM WLP 3/4 COMPLIANT

PC AUDIO

10. SOLDER REFLOW PROFILE

10.1. Standard Reflow Profile Data

Note: These devices can be hand soldered at 360 oC for 3 to 5 seconds.

FROM: IPC / JEDEC J-STD-020C “Moisture/Reflow Sensitivity Classification for Nonhermetic Solid

State Surface Mount Devices” (www.jedec.org/download).

Profile Feature

Average Ramp-Up Rate (Tsmax - Tp)

Preheat:

Temperature Min (Tsmin)

Temperature Max (Tsmax)

Time (tsmin - tsmax)

Time maintained above:

Temperature (TL)

Time (tL)

Peak / Classification Temperature (Tp)

Time within 5 oC of actual Peak Temperature (tp)

Ramp-Down rate

Time 25 oC to Peak Temperature

3 oC / second max

150 oC

200 oC

60 - 180 seconds

217 oC

60 - 150 seconds

Pb Free Assembly

See “Package Classification Reflow Temperatures”

20 - 40 seconds

6 oC / second max

8 minutes max

Note: All temperatures refer to topside of the package, measured on the package body surface.

Table 25. Standard Reflow Profile

Figure 15. Solder Reflow Profile

251

SIX CHANNEL HD AUDIO CODEC, PREMIUM WLP 3/4 COMPLIANT

92HD73C

V 1.3 08/11

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