TDA1170N 查看數據表（PDF） - STMicroelectronics

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TDA1170N

LOW-NOISE TV VERTICAL DEFLECTION SYSTEM

STMicroelectronics 

TDA1170N

MOUNTING INSTRUCTION

During soldering the tab temperature must not

exceed 260°C and the soldering time must not be

longer than 12 seconds.

The external heatsink or printed circuit copper area

must be connected to electrical ground.

The junction to ambient thermal resistance can be

Figure 5 : Example of P.C. Board Copper Area

Used as Heatsink

reduced by soldering the tabs to a suitable copper

area of the printed circuit board (fig. 5) or to an

external heatsink (fig. 6).

The diagram of fig. 7 shows the maximum dissipa-

ble power Ptot and the Rth j-amb as a function of the

side ”e” of two equal square copper areas having

a thicknessof 35 µ (1.4 mil).

Figure 6 : Example of External heatsink

Figure 7 : Maximum Power Dissipation and

Junction-Ambient Thermal

Resistance versus ”e”

Figure 8 : Maximum Allowable Power

Dissipation versus Ambient

Temperature

7/8

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