HMC256 查看數據表（PDF） - Micross Components

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HMC256

GaAs MMIC I/Q MIXER

Micross Components 

Outline Drawing

v03.1007

HMC256

GaAs MMIC I/Q MIXER

5.9 - 12 GHz

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NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM].

2. BOND PADS ARE .004” SQUARE.

3. TYPICAL BOND PAD SPACING CENTER TO CENTER IS .006”.

4. BACKSIDE METALLIZATION: GOLD.

5. BOND PAD METALLIZATION: GOLD.

6. BACKSIDE METAL IS GROUND.

7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

Die Packaging Information [1]

Standard

Alternate

WP-3 (Waffle Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

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