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NCP15XH103J03RC 查看數據表(PDF) - Murata Manufacturing

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NCP15XH103J03RC Datasheet PDF : 44 Pages
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!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
R44E.pdf
Dec.17,2012
Temperature Sensor and Compensation Chip Type !Caution/Notice
Continued from the preceding page.
7. Printing Conditions of Solder Paste
o The amount of solder is critical. Standard height of fillet is
shown in the table below.
o Too much soldering may cause mechanical stress,
resulting in cracking, mechanical and/or electronic
damage.
Reference: Optimum Solder Amount
E
T
Electrode
Solder
Solder
Part Number
NCP03
NCP15
NCP18/NCP21
The Solder Paste Thickness
100μm
150μm
200μm
T
1/3EVTVE
1/3EVTVE
0.2mmVTVE
8. Adhesive Application and Curing
o Thin or insufficient adhesive may result in loose
component contact with land during flow soldering.
o Low viscosity adhesive causes chips to slip after
mounting.
21

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