SPM0408HE5H-SB 查看數據表（PDF） - Unspecified

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SPM0408HE5H-SB

Amplified “Mini” SiSonic™ Microphone Specification With Enhanced RF Protection – Halogen Free

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SPM0408HE5H‐SB

11. SOLDER REFLOW PROFILE

170–180°C

230°C

Pre‐heat

120 sec.

Solder Melt

100 sec.

260°C

Stage

Pre‐heat

Solder Melt

Peak

Temperature Profile

170 ~ 180 C

Above 230 C

260 C maximum

Time (maximum)

120 sec.

100 sec.

30 sec.

Notes:

1.

2.

3.

Do not pull a vacuum over the port hole of the microphone. Pulling a

vacuum over the port hole can damage the device.

Do not board wash after the reflow process. Board washing and cleaning

agents can damage the device. Do not expose to ultrasonic processing or

cleaning.

Number of Reflow = recommend no more than 3 cycles.

12. ADDITIONAL NOTES

(A) Shelf life: Twelve (12) months when devices are to be stored in factory supplied, unopened ESD

moisture sensitive bag under maximum environmental conditions of 30ºC, 70% R.H.

(B) MSL (moisture sensitivity level) Class 2a.

Knowles Acoustics, a division of Knowles Electronics,

LLC.

Revision: B

8 of 10

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