AAAF5051-05 查看數據表（PDF） - Unspecified
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AAAF5051-05 Datasheet PDF : 5 Pages
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REFLOW SOLDERING PROFILE for LEAD-FREE SMD PROCESS
TAPE SPECIFICATIONS (units : mm)
AAAF5051-05
REEL DIMENSION (units : mm)
l Notes:
1. Don't cause stress to the LEDs while it is exposed to high temperature.
ia 2. The maximum number of reflow soldering passes is 2 times.
3. Reflow soldering is recommended. Other soldering methods are not recommended as they might
cause damage to the product.
fident HANDLING PRECAUTIONS
Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is
n more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone
encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED.
o 1. Handle the component along the
side surfaces by using forceps or
C appropriate tools.
2. Do not directly touch or handle the silicone lens
surface. It may damage the internal circuitry.
3. Do not stack together assembled
PCBs containing exposed LEDs.
Impact may scratch the silicone lens
or damage the internal circuitry.
4-1. The inner diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks.
4-2. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup.
4-3. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure
precise pickup and avoid damage during production.
5. As silicone encapsulation is permeable to gases, some corrosive substances such as H2S might corrode silver
plating of leadframe. Special care should be taken if an LED with silicone encapsulation is to be used near such
substances.
© 2018 Kingbright. All Rights Reserved. Spec No: DSAP4576 / 1201009363 Rev No: V.2B Date: 10/05/2018
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