GRM219B31H334KA87 查看數據表（PDF） - Murata Manufacturing

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GRM219B31H334KA87

Chip Multilayer Ceramic Capacitors for General Purpose

Murata Manufacturing 

2. Land Dimensions

　Please confirm the suitable land dimension by evaluating of the actual SET / PCB.

Chip Capacitor

Land

Table 1 Flow Soldering Method

Series

Chip Dimension(L/W) Code

Chip(L×W)

b

a

a

b

GRM

18

1.6×0.8

0.6 to 1.0

0.8 to 0.9

GRM

21

2.0×1.25

1.0 to 1.2

0.9 to 1.0

GRM

31

3.2×1.6

2.2 to 2.6

1.0 to 1.1

Resistance to PCB bending stress may be improved by designing the “a” dimension with solder resist.

Table 2 Reflow Soldering Method

Series

Chip Dimension(L/W) Code

Chip(L×W)

(Dimensions Tolerance)

GRM

01

0.25×0.125

GRM

02

0.4×0.2

GRM

GRM

GRM

GRM

GRM

GRM

GRM

GRM

MD

0.5×0.25

0.6×0.3

(+/-0.03)

03

0.6×0.3

(+/-0.05)

0.6×0.3

(+/-0.09)

1.0×0.5

15

(within +/-0.10)

1.0×0.5

（+/-0.15/+/-0.20）

1.6×0.8

18

(within +/-0.10)

1.6×0.8

(+/-0.15/+/-0.20)

JN

1.8×1.0

2.0×1.25

(within +/-0.10)

21

2.0×1.25

(+/-0.15)

2.0×1.25

(+/-0.20)

3.2×1.6

31

(within+/-0.20)

3.2×1.6

(+/-0.30)

32

3.2×2.5

GRM

43

4.5×3.2

GRM

55

5.7×5.0

a

0.10 to 0.11

0.16 to 0.2

0.17 to 0.23

0.2 to 0.25

0.2 to 0.25

0.23 to 0.3

0.3 to 0.5

0.4 to 0.6

0.6 to 0.8

0.7 to 0.9

0.8 to 0.9

1.2

1.2

1.0 to 1.4

1.8 to 2.0

1.9 to 2.1

2.0 to 2.4

3.0 to 3.5

4.0 to 4.6

b

0.07 to 0.12

0.12 to 0.18

0.22 to 0.28

0.2 to 0.3

0.25 to 0.35

0.25 to 0.35

0.35 to 0.45

0.4 to 0.5

0.6 to 0.7

0.7 to 0.8

0.6 to 0.8

0.6

0.6 to 0.8

0.6 to 0.8

0.9 to 1.2

1.0 to 1.3

1.0 to 1.2

1.2 to 1.4

1.4 to 1.6

GRM219B31H334KA87-01A

Solder Resist

c

0.6 to 0.8

0.8 to 1.1

1.0 to 1.4

(in mm)

c

0.125 to 0.145

0.2 to 0.23

0.25 to 0.30

0.25 to 0.35

0.3 to 0.4

0.3 to 0.4

0.4 to 0.6

0.5 to 0.7

0.6 to 0.8

0.8 to 1.0

0.9 to 1.1

1.25

1.2 to 1.4

1.2 to 1.4

1.5 to 1.7

1.7 to 1.9

1.8 to 2.3

2.3 to 3.0

3.5 to 4.8

(in mm)

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