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TA025 Datasheet PDF - Ohmite Mfg. Co.

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Power Chip® Thick Film on Alumina Substrate

Ohmite’s original Power Chip resistors feature our thick film on alumina substrate technology. These planar packages yield space saving, 10W/in2 power densities that require over 50% less board space than other radial packages. Convection cooling is maximized by the planar package configuration which dissipates heat well above board level.
Ohmite’s power chip resis tors have a 125% higher operating temperature range than competitive product of similar design. High temperature solder and in-process plating keep terminations secure under self-heating effects by preventing re-flow from full power operation.
Flexible packaging schemes make these resistors ideal for power supplies, audio amplifiers, video fly-back, and other power control applications.

• High-Temp Terminal Construction
• Wide Resistance Range
• Low Inductance (50nH-100nH)
• High Power Density
• Easy to install. PC-mountable


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