E818AHF(2000) 查看數據表（PDF） - Semtech Corporation
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E818AHF Datasheet PDF : 12 Pages
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Edge818
EDGE HIGH-PERFORMANCE PRODUCTS
Application Information
Power Supply Decoupling
VCC and VEE should be decoupled to GND with a .1 µF
chip capacitor in parallel with a .001 µF chip capacitor.
A VCC and VEE plane, or at least a solid power bus, is
recommended for optimal performance.
VH and VL Decoupling
must always be positive (above ground), and VEE must
always be negative (at or below ground).
The three diode configuration shown in Figure 5 should
be used on a once-per-board basis.
As the VH and VL inputs are unbuffered and supply the
VCC
driver output current, which can be quite large during
edge transitions, decoupling capacitors for these inputs
are recommended in proportion to the amount of output
current requirements.
VDD
For applications where VH and VL are shared over multiple
channels, a solid power plane to distribute these levels
is preferred.
1N5820 or
Equivalent
VBB
The two VBB pins are connected together on-chip.
Therefore, only one VBB needs to be connected to for
proper 818 operation.
The two pins may be used to daisy chain a VBB signal
across a PC Board without having to route the actual
signal underneath the 818.
Latchup Protection
The Edge818 has several power supply requirements to
protect the part in power supply fault situations, as well
as during power up and power down sequences. VCC
must remain greater than or equal to VDD (external supply
for the digital logic) at all times. Both VCC and VDD
VEE
Figure 5.
Power Supply Protection Scheme
gure 5.
Warning: It is extremely important that the voltage on
any device pin does not exceed the range of VEE –
0.5V to VCC +0.5V at any time, either during power up,
normal operation, or during power down. Failure to
adhere to this requirement could result in latchup of
the device, which could be destructive if the system
power supplies are capable of supplying large amounts
of current. Even if the device is not immediately
destroyed, the cumulative damage caused by the stress
of repeated latchup may affect device reliability.
2000 Semtech Corp.
6
www.semtech.com
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