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HI5735 查看數據表(PDF) - Intersil

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HI5735 Datasheet PDF : 11 Pages
1 2 3 4 5 6 7 8 9 10
HI5735
Pin Descriptions
PIN NUMBER PIN NAME
PIN DESCRIPTION
1-12
D11 (MSB) thru Digital Data Bit 11, the Most Significant Bit thru Digital Data Bit 0, the Least Significant Bit.
D0 (LSB)
15
CLK
Data Clock Pin DC to 80 MSPS.
13, 14
NC
No Connect.
16
17, 28
VCC
DGND
Digital Logic Supply +5V.
Digital Ground.
18
DVEE
-5.2V Logic Supply.
23
RSET
External resistor to set the full scale output current. IFS = 16 x (VREF OUT / RSET). Typically 976.
27
AGND
Analog Ground supply current return pin.
19
ARTN
Analog Signal Return for the R/2R ladder.
21
IOUT
Current Output Pin.
20
IOUT
Complementary Current Output Pin.
22
AVEE
-5.2V Analog Supply.
24
CTRL IN Input to the current source base rail. Typically connected to CTRL OUT and a 0.1µF capacitor to AVEE. Allows
external control of the current sources.
25
CTRL OUT Control Amplifier Out. Provides precision control of the current sources when connected to CTRL IN such that
IFS = 16 x (VREF OUT / RSET).
26
REF OUT -1.23V (typical) bandgap reference voltage output. Can sink up to 125µA or be overdriven by an external
reference capable of delivering up to 2mA.
Detailed Description
The HI5735 is a 12-bit, current out D/A converter. The DAC
can convert at 80 MSPS and runs on +5V and -5.2V supplies.
The architecture is an R/2R and segmented switching current
cell arrangement to reduce glitch. Laser trimming is employed
to tune linearity to true 12-bit levels. The HI5735 achieves its
low power and high speed performance from an advanced
BiCMOS process. The HI5735 consumes 650mW (typical)
and has an improved hold time of only 0.25ns (typical).
Digital Inputs
The HI5735 is a TTL/CMOS compatible D/A. Data is latched
by a Master register. Once latched, data inputs D0 (LSB)
thru D11 (MSB) are internally translated from TTL to ECL.
The internal latch and switching current source controls are
implemented in ECL technology to maintain high switching
speeds and low noise characteristics.
Decoder/Driver
The architecture employs a split R/2R ladder and
Segmented Current source arrangement. Bits D0 (LSB) thru
D7 directly drive a typical R/2R network to create the binary
weighted current sources. Bits D8 thru D11 (MSB) pass thru
a “thermometer” decoder that converts the incoming data
into 15 individual segmented current source enables. This
split architecture helps to improve glitch, thus resulting in a
more constant glitch characteristic across the entire output
transfer function.
Clocks and Termination
The internal 12-bit register is updated on the rising edge of
the clock. Since the HI5735 clock rate can run to 80 MSPS,
to minimize reflections and clock noise into the part, proper
termination should be used. In PCB layout clock runs should
be kept short and have a minimum of loads. To guarantee
consistent results from board to board, controlled impedance
PCBs should be used with a characteristic line impedance
ZO of 50.
To terminate the clock line, a shunt terminator to ground is
the most effective type at a 80 MSPS clock rate. A typical
value for termination can be determined by the equation:
RT = ZO,
for the termination resistor. For a controlled impedance
board with a ZO of 50, the RT = 50. Shunt termination is
best used at the receiving end of the transmission line or as
close to the HI5735 CLK pin as possible.
ZO = 50
CLK
HI5735
DAC
RT = 50
FIGURE 10. CLOCK LINE TERMINATION
7

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