MC14070BF 查看數據表（PDF） - ON Semiconductor
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MC14070BF Datasheet PDF : 8 Pages
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14
1
e
Z
D
b
0.13 (0.005) M
MC14070B, MC14077B
PACKAGE DIMENSIONS
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 965–01
ISSUE O
8
E HE
7
LE
Q1
M_
L
DETAIL P
VIEW P
A
c
A1
0.10 (0.004)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A ––– 2.05 ––– 0.081
A1 0.05 0.20 0.002 0.008
b 0.35 0.50 0.014 0.020
c 0.18 0.27 0.007 0.011
D 9.90 10.50 0.390 0.413
E 5.10 5.45 0.201 0.215
e
1.27 BSC
0.050 BSC
HE 7.40 8.20 0.291 0.323
0.50 0.50 0.85 0.020 0.033
LE 1.10 1.50 0.043 0.059
M 0 _ 10 _ 0 _ 10 _
Q1 0.70 0.90 0.028 0.035
Z ––– 1.42 ––– 0.056
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