HS-80C86RH 查看數據表（PDF） - Intersil

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HS-80C86RH

Radiation Hardened 16-Bit CMOS Microprocessor

Intersil 

Die Characteristics

DIE DIMENSIONS:

6370µm x 7420µm x 485µm

INTERFACE MATERIALS:

Glassivation:

Thickness: 8kÅ ±1kÅ

Metallization Mask Layout

HS-80C86RH

Top Metallization:

Type: Al/Si

Thickness: 11kÅ ±2kÅ

ADDITIONAL INFORMATION:

Worst Case Current Density:

<2 x 105A/cm2

HS-80C86RH

AD10 (6)

AD9 (7)

AD8 (8)

AD7 (9)

AD6 (10)

AD5 (11)

AD4 (12)

AD3 (13)

AD2 (14)

AD1 (15)

AD0 (16)

(36) A18/S5

(35) A19/S6

(34) BHE/S7

(33) MN/MX

(32) RD

(31) RQ/GT0

(30) RQ/GT1

(29) LOCK

(28) S2

(27) S1

(26) S0

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