HS-307RH 查看數據表（PDF） - Intersil

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HS-307RH

Radiation Hardened CMOS Analog Switches

Intersil 

HS-302RH/303RH/306RH/307RH/384RH/390RH/883S

Metallization Topology

DIE DIMENSIONS:

Die Size: 2130 x 1930µm

Die Thickness: 11 ±1 mils

METALLIZATION:

Type: Al, 12.5kÅ ± 2kÅ

Back: Gold

GLASSIVATION:

Type: SiO2

Thickness: 8kÅ ± 1kÅ

Metallization Mask Layout

WORST CASE CURRENT DENSITY: 1.732e05 A/cm2

SUBSTRATE POTENTIAL: Unbiased

PROCESS: DI Linear Metal Gate CMOS

HS-302RH/303RH/306RH/307RH/883S

D3

D4

D1

D2

S1

S2

IN1

IN2

HS-384RH/390RH/883S

S3

V-

GND

S4

V+

Spec Number 518526

15

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