HCTS04D 查看數據表（PDF） - Intersil

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HCTS04D

Radiation Hardened Hex Inverter

Intersil 

Die Characteristics

DIE DIMENSIONS:

87 x 88 mils

2.20mm x 2.24mm

METALLIZATION:

Type: AlSi

Metal Thickness: 11kÅ ± 1kÅ

GLASSIVATION:

Type: SiO2

Thickness: 13kÅ ± 2.6kÅ

WORST CASE CURRENT DENSITY:

<2.0 x 105A/cm2

BOND PAD SIZE:

100µm x 100µm

4 x 4 mils

Metallization Mask Layout

Y1 (2)

A2 (3)

Y2 (4)

A3 (5)

HCTS04MS

HCTS04MS

A1

VCC

A6

(1)

(14)

(13)

(6)

(7)

(8)

Y3

GND

Y4

(12) Y6

(11) A5

(10) Y5

(9) A4

Spec Number 518776

387

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