ICS671M-01 查看數據表（PDF） - Integrated Circuit Systems
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ICS671M-01 Datasheet PDF : 4 Pages
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ICS671-01
Zero Delay, Low Skew Buffer and Multipler
Package Outline and Package Dimensions
(For current dimensional specifications, see JEDEC Publication No. 95.)
INDEX
AREA
12
D
EH
h x 45°
16 pin SOIC narrow
Symbol
A
A1
B
C
D
E
e
H
h
L
Inches
Min Max
0.0532 0.0688
0.0040 0.0098
0.0130 0.0200
0.0075 0.0098
0.3859 0.3937
0.1497 0.1574
.050 BSC
0.2284 0.2440
0.0099 0.0195
0.0160 0.0500
Millimeters
Min Max
1.35 1.75
0.10 0.24
0.33 0.51
0.19 0.24
9.80 10.00
3.80 4.00
1.27 BSC
5.80 6.20
0.25 0.50
0.41 1.27
A1
C
A
e
B
L
Ordering Information
Part/Order Number
ICS671M-01
ICS671M-01T
Marking
ICS671M-01
ICS671M-01
Shipping packaging
tubes
tape and reel
Package
16 pin SOIC
16 pin SOIC
Temperature
0-70 °C
0-70 °C
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems, Incorporated (ICS) assumes no responsibility for either its
use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is
intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary
environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any circuitry or specifications without notice. ICS does
not authorize or warrant any ICS product for use in life support devices or critical medical instruments.
MDS 671-01 B
4
Revision 051700
Printed 11/15/00
Integrated Circuit Systems, Inc.• 525 Race Street • San Jose •CA•95126• (408) 295-9800 tel • www.icst.com
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