SB840 查看數據表（PDF） - Micro Electro Magnetical Tech

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SB840

SCHOTTKY DIE SPECIFICATION

Micro Electro Magnetical Tech 

Micro-Electro-Magnetical Tech Co.

SCHOTTKY DIE SPECIFICATION

General Description: 40 V 8 A Standard VF

TYPE: SB840

Single Anode

ELECTRICAL CHARACTERISTICS

DC Blocking Voltage: Ir=1mA(for wafer form)

Ir=0.5mA (for dice form)

Average Rectified Forward Current

Maximum Instantaneous Forward Voltage

@ 8 Amperes,Ta= 25°C

@ 10 Amperes, 25°C

Maximum Instantaneous Reverse Voltage

VR= 40 Volt, Ta=25°C

SYM

VRRM

IFAV

VF MAX

VF MAX

IR MAX

Spec. Limit

40

8

0.5

0.54

0.3

Maximum Junction Capacitance @ 0V, 1MHZ

MAXIMUM RATINGS

Nonrepetitive Peak Surge Current

Operating Junction Temperature

Storage Temperatures

Cj MAX

IFSM

Tj

TSTG

225

-65 to +125

-65 to +125

Specification apply to die only. Actual performance may degrade when assembled.

MEMT does not guarantee device performance after assembly.

Data sheet information is subjected to change without notice.

DICE OUTLINE DRAWING

Die Sort UNIT

42.5 Volt

Amp

0.49 Volt

0.53 Volt

0.25 mA

pF

Amp

°C

°C

A

C

B

Top-side Metal

SiO2 Passivation

D

P+ Guard Ring

Back-side Metal

DIM

ITEM

um2 Mil2

A Die Size

2220 87.40

B Top Metal Pad Size 2120 83.5

C Passivation Seal

2140 84.3

D Thickness (Min)

254

10

Thickness (Max)

305

12

PS:

(1)Cutting street width is around 80um(3.14mil).

(2)Both of top-side and back-side metals are Ti/Ni/Ag.

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