MAX2065ETLT 查看數據表（PDF） - Maxim Integrated

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MAX2065ETLT

50MHz to 1000MHz High-Linearity, Serial/Parallel-Controlled Analog/Digital VGA

Maxim Integrated 

50MHz to 1000MHz High-Linearity, Serial/

Parallel-Controlled Analog/Digital VGA

ABSOLUTE MAXIMUM RATINGS

VCC_ to GND ........................................................-0.3V to +5.5V

VDD_LOGIC, DATA, CS, CLK, SER/PAR, VDAC_EN,

VREF_SELECT.....................................-0.3V to (VCC_ + 0.3V)

STATE_A, STATE_B, D0–D4 ....................-0.3V to (VCC_ + 0.3V)

AMP_IN, AMP_OUT, VREF_IN,

ANALOG_VCTRL ................................-0.3V to (VCC_ + 0.3V)

ATTEN1_IN, ATTEN1_OUT, ATTEN2_IN,

ATTEN2_OUT...................................................-1.2V to + 1.2V

RSET to GND........................................................-0.3V to + 1.2V

RF Input Power (ATTEN1_IN, ATTEN1_OUT,

ATTEN2_IN, ATTEN2_OUT).......................................+20dBm

RF Input Power (AMP_IN)...............................................+18dBm

Continuous Power Dissipation (Note 1) ...............................6.5W

θJA (Notes 2, 3)..............................................................+38°C/W

θJC (Note 3) ...................................................................+10°C/W

Operating Temperature Range (Note 4) .....TC = -40°C to +85°C

Maximum Junction Temperature .....................................+150°C

Storage Temperature.........................................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Note 1: Based on junction temperature TJ = TC + (θJC x VCC x ICC). This formula can be used when the temperature of the exposed

pad is known while the device is soldered down to a printed-circuit board (PCB). See the Applications Information section

for details. The junction temperature must not exceed +150°C.

Note 2: Junction temperature TJ = TA + (θJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150°C.

Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a 4-layer

board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Note 4: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS

(Typical Application Circuit, high-current (HC) mode, VCC = +3.0V to +3.6V, TC = -40°C to +85°C. Typical values are at VCC = +3.3V

and TC = +25°C, unless otherwise noted.)

PARAMETER

SYMBOL

CONDITIONS

MIN TYP MAX UNITS

Supply Voltage

VCC

3.0

3.3

3.6

V

Supply Current

ICC

60

80

mA

LOGIC INPUTS (DATA, CS, CLK, VDAC_EN, VREF_SELECT, SER/PAR, STATE_A, STATE_B, D0–D4)

Input High Voltage

VIH

Input Low Voltage

VIL

2

V

0.8

V

+5V SUPPLY DC ELECTRICAL CHARACTERISTICS

(Typical Application Circuit, VCC = +4.75V to +5.25V, TC = -40°C to +85°C. Typical values are at VCC = +5V and

TC = +25°C, unless otherwise noted.)

PARAMETER

SYMBOL

CONDITIONS

MIN TYP MAX UNITS

Supply Voltage

VCC

4.75

5

5.25

V

Supply Current

Low-current (LC) mode

ICC

High-current (HC) mode

73

93

mA

124

146

LOGIC INPUTS (DATA, CS, CLK, VDAC_EN, VREF_SELECT, SER/PAR, STATE_A, STATE_B, D0–D4)

Input High Voltage

VIH

3

V

Input Low Voltage

VIL

0.8

V

Input Current Logic-High

IIH

-1

+1

µA

Input Current Logic-Low

IIL

-1

+1

µA

2 _______________________________________________________________________________________

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