MAX2042ETP 查看數據表（PDF） - Maxim Integrated

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MAX2042ETP

SiGe High-Linearity, 2000MHz to 3000MHz Upconversion/Downconversion Mixer with LO Buffer

Maxim Integrated 

SiGe High-Linearity, 2000MHz to 3000MHz

Upconversion/Downconversion Mixer with LO Buffer

ABSOLUTE MAXIMUM RATINGS

VCC to GND..........................................................-0.3V to +5.5V

IF+, IF-, LOBIAS to GND.......................... -0.3V to (VCC + 0.3V)

RF, LO Input Power....................................................... +20dBm

RF, LO Current (RF and LO are DC shorted

to GND through a balun)................................................50mA

Continuous Power Dissipation (Note 1) ..............................5.0W

BJA (Notes 2, 3)............................................................ +38NC/W

BJC (Notes 1, 3)............................................................ +13NC/W

Operating Case Temperature Range

(Note 4)........................................................... -40NC to +85NC

Junction Temperature......................................................+150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s).................................+300NC

Note 1: Based on junction temperature TJ = TC + (BJC x VCC x ICC). This formula can be used when the temperature of the

exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.

The junction temperature must not exceed +150NC.

Note 2: Junction temperature TJ = TA + (BJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150NC.

Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Note 4: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

+5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS

(Typical Application Circuit, VCC = +4.75V to +5.25V, no input AC signals. TC = -40NC to +85NC, unless otherwise noted. Typical

values are at VCC = +5.0V, TC = +25NC, all parameters are production tested.)

PARAMETER

SYMBOL

CONDITIONS

MIN TYP MAX UNITS

Supply Voltage

VCC

Supply Current

ICC

4.75 5.0 5.25

V

138 150

mA

+3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS

(Typical Application Circuit, VCC = +3.0V to +3.6V, no input AC signals. TC = -40NC to +85NC, unless otherwise noted. Typical values

are at VCC = +3.3V, TC = +25NC, all parameters are production tested.)

PARAMETER

SYMBOL

CONDITIONS

MIN TYP MAX UNITS

Supply Voltage

VCC

Supply Current

ICC

3.0

3.3

3.6

V

120 135

mA

RECOMMENDED AC OPERATING CONDITIONS

PARAMETER

RF Frequency Range

LO Frequency

SYMBOL

fLO

CONDITIONS

Typical Application Circuit with

C1 = 8.2pF, see Table 1 for details

(Notes 5, 6)

(Notes 5, 6)

MIN TYP MAX UNITS

2000

3000 MHz

1800

2800 MHz

IF Frequency

Using M/A-Com MABAES0029 1:1

fIF

transformer as defined in the Typical

Application Circuit, IF matching components

50

affect the IF frequency range (Notes 5, 6)

500 MHz

LO Drive

PLO (Notes 5, 6)

-3

0

+3

dBm

2   _______________________________________________________________________________________

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