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MAX2078

Octal-Channel Ultrasound Front-End with CW Doppler Mixers

Maxim Integrated 

Octal-Channel Ultrasound Front-End

with CW Doppler Mixers

ABSOLUTE MAXIMUM RATINGS

VCC_ to GND .........................................................-0.3V to +5.5V

VCC2 - VCC1......................................................................> -0.3V

CI_, CQ_ to GND ....................................................-0.3V to +13V

ZF_, IN_, AG to GND ................................-0.3V to (VCC_ + 0.3V)

INC_ ..............................................................................20mA DC

VREF to GND.............................................................-0.3V to +3V

IN_ to AG ...............................................................-0.6V to +0.6V

OUT_, LO_, DIN, DOUT, VG_, NP, CS, CLK, PD,

CLP, V/C to GND......................................-0.3V to VCC1 + 0.3V

CI_, CQ_, VCC_, VREF analog and digital control signals must

be applied in this order

Input Differential Voltage .............................2.0VP-P differential

Continuous Power Dissipation (TA = +70°C)

68-Pin TQFN (derated 40mW/°C above +70°C) ..................4W

Operating Temperature Range (Note 1).................0°C to +70°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-40°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow) .......................................+260°C

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHRACTERISTICS (Notes 2, 3, 4)

64 TQFN

Junction-to-Ambient Thermal Resistance (θJA)........20°C/W

Junction-to-Case Thermal Resistance (θJC)............0.5°C/W

Note 2: Junction temperature TJ = TC + (θJC x VCC x ICC). This formula can only be used if the component is soldered down to a printed

circuit board pad containing multiple ground vias to remove the heat. The junction temperature must not exceed 150°C.

Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

Note 4: Junction temperature TJ = TA + (θJA x VCC x ICC), assuming there is no heat removal from the exposed pad. The junction

temperature must not exceed 150°C.

DC ELECTRICAL CHARACTERISTICS

(Typical Application Circuit, VREF = 2.475V to 2.525V, VCC1 = 3.13V to 3.47V, VCC2 = 4.5V to 5.25V, TA = 0°C to +70°C, VGND = 0V,

CLP = 0, PD = 0, no RF signals applied. Typical values are at VCC1 = 3.3V, VCC2 = 4.75V, TA = +25°C, unless otherwise noted.) (Note 5)

PARAMETER

SYMBOL

CONDITIONS

MIN TYP MAX UNITS

3.3V Supply Voltage

VCC1

3.13

3.3

3.47

V

4.75V/5V Supply Voltage

VCC2

4.5

4.75 5.25

V

External Reference Voltage Range

VREF (Note 6)

2.475

2.525

V

CMOS Input High Voltage

VIH

Applies to CMOS control inputs

2.5

V

CMOS Input Low Voltage

VIL

Applies to CMOS control inputs

0.8

V

CMOS Input Leakage Current

IIN

TA = +25oC, applies to CMOS control inputs;

0 to 3.47V

10

µA

DATA Output High Voltage

DATA Output Low Voltage

DOUT_HI 10MΩ load

DOUT_LO 10MΩ load

VCC1

V

0

V

DC ELECTRICAL CHARACTERISTICS—VGA MODE

(Typical Application Circuit, VREF = 2.475V to 2.525V, VCC1 = 3.13V to 3.47V, VCC2 = 4.5V to 5.25V, TA = 0°C to +70°C, VGND = 0V,

NP = 0, V/C = 1, CLP = 0, PD = 0, no RF signals applied. Typical values are at VCC1 = 3.3V, VCC2 = 4.75V, TA = +25°C, unless other-

wise noted.) (Note 5)

PARAMETER

SYMBOL

CONDITIONS

MIN TYP MAX UNITS

4.75V/5V Supply Standby Current

I_NP_5V_TOT NP = 1, all channels

3.9

6

mA

3V Supply Standby Current

I_NP_3V_TOT NP = 1, all channels

1.7

3

mA

4.75V/5V Power-Down Current

I_PD_5V_TOT PD = 1, all channels

0.4

10

µA

2 _______________________________________________________________________________________

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