MAX2092ETPT(2012) 查看數據表（PDF） - Maxim Integrated

零件编号

产品描述 (功能)

比赛名单

MAX2092ETPT
(Rev.:2012)

700MHz to 2700MHz Analog VGA with Threshold Alarm Circuit and Error Amplifier for Level Control

Maxim Integrated 

MAX2092

700MHz to 2700MHz Analog VGA with Threshold

Alarm Circuit and Error Amplifier for Level Control

ABSOLUTE MAXIMUM RATINGS

VCC_RF, VCC_A.........................................................-0.3V to +6V

RF_OUT, RF_IN......................................... -0.3V to (VCC + 0.3V)

R_BIAS, CTRL1, CTRL2,

PLVLSET, DET_VIN.... -0.3V to Minimum (VCC + 0.3V, +3.6V)

RF_IN Input Power......................................................... +15dBm

RF_OUT Output Power................................................... +23dBm

Continuous Power Dissipation (Note 1) ..............................2.5W

Operating Case Temperature

Range (Note 2)................................................ -40NC to +95NC

Maximum Junction Temperature......................................+150NC

Storage Temperature Range............................. -65NC to +150NC

Lead Temperature (soldering, 10s).................................+300NC

Soldering Temperature (reflow)..................................... +260NC

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Note 1: Based on junction temperature TJ = TC + (BJC x VCC x ICC). This formula can be used when the temperature of the

exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.

The junction temperature must not exceed +150NC.

Note 2: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.

PACKAGE THERMAL CHARACTERISTICS

Junction-to-Ambient Thermal Resistance (qJA)

(Notes 3, 4).................................................................. 32°C/W

Junction-to-Case Thermal Resistance (qJC)

(Notes 1, 4).................................................................... 7°C/W

Note 3: Junction temperature TJ = TA + (qJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150NC.

Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

DC ELECTRICAL CHARACTERISTICS

(Typical Application Circuit with VCC = 4.75V to 5.8V, VGND = 0V, and TC = -40°C to +95°C. Typical values are at VCC = 5.5V and

TC = +25°C, unless otherwise noted.) (Note 5)

PARAMETER

Supply Voltage

Total Supply Current

CTRL1/CTRL2 Logic-Low Input

Voltage

SYMBOL

VCC

IDC

CONDITIONS

Power down: CTRL1 = 0, CTRL2 = 0

VGA-only mode: CTRL1 = 1, CTRL2 = 0

ALC mode: CTRL1 = 1, CTRL2 = 1

VIL

MIN TYP MAX UNITS

4.75

5.8

V

2

3

80

90

mA

93

110

0.8

V

CTRL1, CTRL2 Logic-High Input

Voltage

Input Logic Current

VIH

IIH, IIL

2.2

V

-1

+1

µA

PLVLSET Input-Voltage Range

VIN

0

2.5

V

DET_VIN Input-Voltage Range

VIN

0

2.5

V

  2

Share Link: