MAX44250AUA 查看數據表（PDF） - Maxim Integrated

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MAX44250AUA

20V, Ultra-Precision, Low-Noise Op Amps

Maxim Integrated 

MAX44250/MAX44251/MAX44252

20V, Ultra-Precision, Low-Noise Op Amps

Absolute Maximum Ratings

Supply Voltage (VDD to VSS).................................-0.3V to +22V

All Other Pins...................................(VSS - 0.3V) to (VDD + 0.3V)

Short-Circuit Duration to Either Supply Rail............................. 1s

Continuous Input Current (any pin).................................. ±20mA

Differential Input Voltage....................................................... ±6V

Maximum Power Dissipation (TA = +70°C)

5-Pin SOT23 (derate 3.1mW/°C above +70°C).........246.7mW

8-Pin SOT23 (derate 9.1mW/°C above +70°C)............727mW

µMAX (derate 4.5 mW/°C above +70°C).....................362mW

SO (derate 8.3 mW/°C above +70°C).......................666.7mW

Operating Temperature Range......................... -40°C to +125NC

Junction Temperature......................................................+150NC

Storage Temperature Range............................. -65°C to +150NC

Lead Temperature (soldering, 10s)............................... +300NC

Soldering Temperature (reflow)..................................... +260NC

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Package Thermal Characteristics (Note 1)

5-Pin SOT23

Junction-to-Ambient Thermal Resistance (ΘJA)..... 324.3°C/W

Junction-to-Case Thermal Resistance (ΘJC)................82°C/W

8-Pin SOT23

Junction-to-Ambient Thermal Resistance (ΘJA)........ 196°C/W

Junction-to-Case Thermal Resistance (ΘJC)................70°C/W

µMAX

Junction-to-Ambient Thermal Resistance (ΘJA).........221°C/W

Junction-to-Case Thermal Resistance (ΘJC)................42°C/W

SO

Junction-to-Ambient Thermal Resistance (ΘJA).........120°C/W

Junction-to-Case Thermal Resistance (ΘJC)................37°C/W

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Electrical Characteristics

(VDD = 10V, VSS = 0V, VIN+ = VIN- = VDD/2, RL = 10kI to VDD/2, TA = -40°C to +125°C, unless otherwise noted. Typical values are

at TA = +25°C.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN TYP MAX UNITS

POWER SUPPLY

Supply Voltage Range

Power-Supply Rejection Ratio

(Note 3)

VDD

PSRR

Guaranteed by PSRR

VDD = 2.7V to 20V, VCM = 0V

2.7

20

V

140

145

dB

Quiescent Current per Amplifier

(MAX44250)

IDD

RL = J

Quiescent Current per Amplifier

(MAX44251/MAX44252)

IDD

RL = J

Power-Up Time

tON

DC SPECIFICATIONS

TA = +25NC

-40NC < TA < +125NC

TA = +25NC

-40NC < TA < +125NC

1.22

1.7

mA

1.85

1.15 1.55

mA

1.75

25

Fs

Input Common-Mode Range

VCM

Guaranteed by CMRR test

VSS -

0.05

VDD -

1.5

V

Common-Mode Rejection Ratio

(Note 3)

Input Offset Voltage

(MAX44250) (Note 3)

CMRR

VOS

TA = +25NC, VCM = -0.05V to (VDD -

1.5V)

-40NC < TA < +125NC

TA = +25NC

133

140

dB

130

3

9

FV

Maxim Integrated

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