OM183SC 查看數據表（PDF） - Omnirel Corp => IRF
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OM183SC Datasheet PDF : 5 Pages
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MECHANICAL OUTLINE
OM183SC - OM186ST - OM186SR
SOLDERING FOOTPRINT
1 23
Pin 1: Adjust
Pin 2: Vout
Pin 3: Vin
Case N/C
TYPICAL SOLDERING PROFILE
Figure 1 shows a typical soldering profile for the D2 and D3 Packages when soldering a to a printed circuit board. The
profile will vary from system to system and solders to solders. Factors that can affect the profile include the type of sol-
dering system used, density and type of components on the board or substrate material being used. This profile shows
temperature versus time. The two profiles described are based on a high density and a low density board. The type sol-
der used was 62/36/2 Tin Lead Silver with a melting point between 177-189ºC. An convection/infrared soldering reflow
system was used. The circuit and solder joints heat up first due to their mass followed by the components which typi-
cally run 30 degrees cooler than the solder joints.
TYPICAL HEATING PROFILE
OM
Omnirel
PART NUMBER DESIGNATOR
183
S
R
M
Device
Type
Isolated
Package
Package
Style
Hi-Rel Screening
Level
205 Crawford Street, Leominster, MA 01453 USA (508) 534-5776 FAX (508) 537-4246
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