SC18IM700 查看數據表（PDF） - Philips Electronics

零件编号

产品描述 (功能)

生产厂家

SC18IM700

Master I2C-bus controller with UART interface

Philips Electronics 

Philips Semiconductors

13. Package outline

SC18IM700

Master I2C-bus controller with UART interface

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

D

c

y

Z

16

9

E

A

X

HE

vM A

pin 1 index

1

e

8

wM

bp

A2

A1

Q

(A 3)

A

θ

Lp

L

detail X

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

A

max.

A1

A2

A3

bp

c

D (1) E (2)

e

HE

mm

1.1

0.15

0.05

0.95

0.80

0.25

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

0.65

6.6

6.2

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

IEC

REFERENCES

JEDEC

JEITA

SOT403-1

MO-153

L

Lp

Q

v

w

y

Z (1) θ

1

0.75 0.4

0.50 0.3

0.2 0.13 0.1

0.40

0.06

8o

0o

EUROPEAN

PROJECTION

ISSUE DATE

99-12-27

03-02-18

Fig 18. Package outline SOT403-1 (TSSOP16)

SC18IM700_1

Product data sheet

Rev. 01 — 28 February 2006

© Koninklijke Philips Electronics N.V. 2006. All rights reserved.

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