UPD16804GS 查看數據表（PDF） - NEC => Renesas Technology

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UPD16804GS

MONOLITHIC H BRIDGE DRIVER CIRCUIT

NEC => Renesas Technology 

µPD16804

RECOMMENDED SOLDERING CONDITIONS

It is recommended to solder this product under the conditions described below.

For soldering methods and conditions other than those listed below, consult NEC.

Surface mount type

For the details of the recommended soldering conditions of this type, refer to Semiconductor Device Mounting

Technology Manual (C10535E).

µPD16804GS

Soldering Method

Infrared reflow

VPS

Wave soldering

Soldering Conditions

Peak package temperature: 235 °C, Time: 30 seconds MAX. (210 °C MIN.),

Number of times: 2 MAX.

Peak package temperature: 215 °C, Time: 40 seconds MAX. (200 °C MIN.),

Number of times: 2 MAX.

Soldering bath temperature: 260 °C Time: 10 seconds MAX.,

Preheating temperature: 120 °C MAX. (package surface temperature),

Number of times: 1

Symbol of

Recommended

Soldering

IR35-00-2

VP15-00-2

WS60-00-1

Note The number of storage days at 25 °C, 65% RH after the dry pack has been opened

Caution Do not use two or more soldering methods in combination (except pin partial heating).

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