AIC2511-12PT5 查看數據表（PDF） - Analog Intergrations
零件编号
产品描述 (功能)
比赛名单
AIC2511-12PT5 Datasheet PDF : 13 Pages
| |||
AIC2511
PIN DESCRIPTIONS
PIN 1: IN
PIN 2: OUT
PIN 3: GND
Supply voltage input for the IC
switching regulator. A suitable input
bypass capacitor must be present
at this pin to minimize voltage
transients and to supply the
switching currents needed by the
regulator.
Internal switch. The voltage at this
pin switches between (VIN-VSAT)
and approximately -0.5V, with a
duty cycle of approximately
VOUT/VIN.
Ground requires a short, low noise
connection to ensure good load
regulation.
PIN 4: FB
Feedback input for fixed-output or
adjustable-output version. Connect
directly to output for fixed
operation version or to a resistor
divider for adjustable operation
versions.
PIN 5: ON / OFF Allows the switching regulator
circuit to be shutdown using logic
level signals thus dropping the
total input supply current to
approximately 80µA. Drive it high
to disable the reference, control
circuitry and internal switches.
Drive low or connect to GND for
normal operation.
APPLICATION INFORMATION
Thermal considerations
The AIC2511 is available with TO-220-5, TO-
220B, TO-263-5 and TO-252-5 packages. The
TO-220-5 and TO-220B packages need a heat
sink in most conditions. The TO-263-5 and TO-
252-5 packages are designed to be soldered to
the copper on a printed circuit board. The printed
circuit board is the heat sink for TO-263-5 and
TO-252-5 packages and other heat components,
such as inductors and diodes. The size of the heat
sink depends on the power loss of AIC2511 and
the ambient temperature. The power loss of
AIC2511 is determined by input voltage, output
voltage and load current. The Fig.4 represents the
curve of the AIC2511 case temperature in
different conditions.
The curve shows the AIC2511 temperature rises
above ambient temperature for a 3A load with
different input and output voltage. The values of
the temperature rise, which are affected by factors
such as sink size, heat produced from heat
components, and etc., may be different from those
in Fig.8 depending on the conditions of the
application. According to the equation 1, as the
power loss or ambient temperature is rising the
heat sink size must be increased to decrease the
thermal resistance ( Rθ jA ) so that the junction
temperature does not over 125۫ C. An appropriate
increase of heat sink size may result in a normal-
ranged junction temperature.
PD
=
Tj − TA
Rθ jA
As junction temperature rises to its temperature
protect point, the AIC2511 will stop working.
Output voltage drops to zero until the junction
temperature decreases to a normal range.
8
Share Link: 