AD8156
OUTLINE DIMENSIONS
8.20
8.00 SQ
7.80
A1 CORNER
INDEX AREA
7654 321
A
BALL A1
PAD CORNER
B
C
TOP VIEW
6.00
BSC SQ
D
E
F
G
*1.85
1.71
1.50
DETAIL A
BOTTOM
1.00 VIEW
BSC
DETAILA
0.25
MIN
*1.31
1.21
1.10
0.70
0.60
0.50
BALL DIAMETER
SEATING
PLANE
COPLANARITY
0.20
*COMPLIANT WITH JEDEC STANDARDS MO-192-ABB-1
WITH EXCEPTION TO PACKAGE HEIGHT AND THICKNESS.
Figure 26. 49-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-49-3)
Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
AD8156ABCZ1
−40°C to +85°C
AD8156-EVALZ1
1 Z = RoHS Compliant Part.
Package Description
49-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Evaluation Board
Package Option
BC-49-3
Rev. 0 | Page 19 of 20