RMDA25000 查看數據表（PDF） - Raytheon Company
零件编号
产品描述 (功能)
比赛名单
RMDA25000 Datasheet PDF : 6 Pages
| |||
RMDA25000
23-28 GHz Driver Amplifier MMIC
Figure 1
Functional Block
Diagram
RF IN
MMIC Chip
Drain Supply Vd
ADVANCED INFORMATION
RF OUT
Figure 2
Chip Layout and Bond Pad
locations.
Dimensions in mm
Chip size is 2.79 mm x
1.63 mm x 50 µm. Back of
chip is RF and DC ground.
Ground (Back of Chip) Gate Supply Vg
0.115
1.303
Figure 3
Recommended
Application Schematic
Circuit Diagram
0.0
0.115
0.0
Bond Wire Ls
1.895
Drain Supply
10000pF (Vd= +5 V)
100pF
100pF 100pF
2.614
1.629
1.452
1.028
0.843
0.658
0.177
2.614 2.794
MMIC Chip
RF IN
RF OUT
Ground
(Back of Chip)
100pF
100pF 100pF
Bond Wire Ls
www.raytheon.com/micro
10000pF
Gate Supply
(Vg)
Characteristic performance data and specifications are subject to change without notice.
Revised April 16, 2001
Page 2
Raytheon RF Components
362 Lowell Street
Andover, MA 01810
Share Link: 