AD9231(Rev0) 查看數據表（PDF） - Analog Devices

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AD9231
(Rev.:Rev0)

12-Bit, 20 MSPS/40 MSPS/65 MSPS/80 MSPS, 1.8 V Dual Analog-to-Digital Converter

Analog Devices 

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

AVDD to AGND

DRVDD to AGND

VIN+A, VIN+B, VIN−A, VIN−B to AGND

CLK+, CLK− to AGND

SYNC to AGND

VREF to AGND

SENSE to AGND

VCM to AGND

RBIAS to AGND

CSB to AGND

SCLK/DFS to AGND

SDIO/DCS to AGND

OEB to AGND

PDWN to AGND

D0A/D0B through D11A/D11B to AGND

DCOA/DCOB to AGND

Operating Temperature Range (Ambient)

Maximum Junction Temperature Under Bias

Storage Temperature Range (Ambient)

Rating

−0.3 V to +2.0 V

−0.3 V to +3.9 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to DRVDD + 0.3 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to AVDD + 0.2 V

−0.3 V to DRVDD + 0.3 V

−0.3 V to DRVDD + 0.3 V

−0.3 V to DRVDD + 0.3 V

−0.3 V to DRVDD + 0.3 V

−0.3 V to DRVDD + 0.3 V

−0.3 V to DRVDD + 0.3 V

−0.3 V to DRVDD + 0.3 V

−40°C to +85°C

150°C

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

AD9231

THERMAL CHARACTERISTICS

The exposed paddle is the only ground connection for the chip.

The exposed paddle must be soldered to the AGND plane of the

user’s circuit board. Soldering the exposed paddle to the user’s

board also increases the reliability of the solder joints and

maximizes the thermal capability of the package.

Table 7. Thermal Resistance

Package Type

Airflow

Velocity

(m/sec)

64-Lead LFCSP 0

9 mm × 9 mm 1.0

(CP-64-4)

2.5

θJA1, 2

23

20

18

θJC1, 3

2.0

θJB1, 4

12

1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).

3 Per MIL-Std 883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

Unit

°C/W

°C/W

°C/W

Typical θJA is specified for a 4-layer PCB with a solid ground

plane. As shown in Table 7, airflow improves heat dissipation,

which reduces θJA. In addition, metal in direct contact with the

package leads from metal traces, through holes, ground, and

power planes, reduces the θJA.

ESD CAUTION

Rev. 0 | Page 9 of 36

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