AD9235(RevB) 查看數據表（PDF） - Analog Devices
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AD9235 Datasheet PDF : 32 Pages
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AD9235
ABSOLUTE MAXIMUM RATINGS1
Pin Name
With
Respect to Min Max
Unit
ELECTRICAL
AVDD
DRVDD
AGND
AVDD
Digital Outputs
CLK, MODE
VIN+, VIN–
VREF
SENSE
REFB, REFT
PDWN
AGND
DGND
DGND
DRVDD
DGND
AGND
AGND
AGND
AGND
AGND
AGND
ENVIRONMENTAL2
Operating Temperature
Junction Temperature
Lead Temperature (10 sec)
Storage Temperature
–0.3 +3.9
V
–0.3 +3.9
V
–0.3 +0.3
V
–3.9 +3.9
V
–0.3 DRVDD + 0.3 V
–0.3 AVDD + 0.3 V
–0.3 AVDD + 0.3 V
–0.3 AVDD + 0.3 V
–0.3 AVDD + 0.3 V
–0.3 AVDD + 0.3 V
–0.3 AVDD + 0.3 V
–40 +85
°C
150
°C
300
°C
–65 +150
°C
NOTES
1Absolute maximum ratings are limiting values to be applied individually and
beyond which the serviceability of the circuit may be impaired. Functional
operability is not necessarily implied. Exposure to absolute maximum rating
conditions for an extended period of time may affect device reliability.
2Typical thermal impedances (28-lead TSSOP), θJA = 67.7°C/W; (32-lead LFCSP),
θJA = 32.5°C/W, θJC = 32.71°C/W. These measurements were taken on a 4-layer
board in still air, in accordance with EIA/JESD51-1.
EXPLANATION OF TEST LEVELS
I 100% production tested.
II 100% production tested at 25°C and sample tested at
specified temperatures.
III Sample tested only.
IV Parameter is guaranteed by design and characterization testing.
V Parameter is a typical value only.
VI 100% production tested at 25°C; guaranteed by design and
characterization testing for industrial temperature range;
100% production tested at temperature extremes for military
devices.
ORDERING GUIDE
Model
Temperature Range Package Description
Package Option
AD9235BRU-20 –40°C to +85°C
AD9235BRU-40 –40°C to +85°C
AD9235BRU-65 –40°C to +85°C
AD9235BCP-20* –40°C to +85°C
AD9235BCP-40* –40°C to +85°C
AD9235BCP-65* –40°C to +85°C
AD9235-20PCB
AD9235-40PCB
AD9235-65PCB
AD9235BCP-20EB
AD9235BCP-40EB
AD9235BCP-65EB
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
28-Lead Thin Shrink Small Outline Package (TSSOP)
RU-28
32-Lead Lead Frame Chip Scale Package (LFCSP) (Contact Factory) CP-32
32-Lead Lead Frame Chip Scale Package (LFCSP) (Contact Factory) CP-32
32-Lead Lead Frame Chip Scale Package (LFCSP)
CP-32
TSSOP Evaluation Board
TSSOP Evaluation Board
TSSOP Evaluation Board
LFCSP Evaluation Board (Contact Factory)
LFCSP Evaluation Board (Contact Factory)
LFCSP Evaluation Board
*It is recommended that the exposed paddle be soldered to the ground plane. There is an increased reliability of the solder joints and maximum thermal capability of
the package is achieved with exposed paddle soldered to the customer board.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD9235 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
REV. B
–5–
WARNING!
ESD SENSITIVE DEVICE
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