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EV-ADF4157SD1Z 查看數據表(PDF) - Analog Devices

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EV-ADF4157SD1Z Datasheet PDF : 24 Pages
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Data Sheet
ADF4157
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, GND = AGND = DGND = 0 V, VDD = AVDD = DVDD, unless otherwise noted.
Table 3.
Parameter
AVDD/DVDD to AGND/DGND
AVDD to DVDD
VP to AGND/DGND
VP to AVDD/DVDD
Digital I/O Voltage to AGND/DGND
Analog I/O Voltage to AGND/DGND
REFIN, RFINx to AGND/DGND
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Maximum Junction Temperature
Reflow Soldering
Peak Temperature
Time at Peak Temperature
Rating
−0.3 V to +4 V
−0.3 V to +0.3 V
−0.3 V to +5.8 V
−0.3 V to +5.8 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to +85°C
−65°C to +125°C
150°C
260°C
40 sec
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θJA
TSSOP
112
LFCSP (Paddle Soldered)
30.4
Unit
°C/W
°C/W
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. D | Page 5 of 24

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