AIC1189-20PY3TB 查看數據表（PDF） - Analog Intergrations
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AIC1189-20PY3TB Datasheet PDF : 20 Pages
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TO-263-3L PIN PACKAGE OUTLINE DRAWING
E
L1
A
c2
AIC1189
AA
b2
e
D
H
L2
SEE VIEW B
WITH PLATING
b
c
BASE METAL
SECTION A-A
GAUGE PLANE
L3
L
VIEW B
SEATING PLANE
A1
Note: 1. Refer to JEDEC TO-263AB.
2. Dimension "E" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "D" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
dimensions are not necessarily exact.
S
TO-263-3L
Y
M
B
MILLIMETERS
O
L
MIN.
MAX.
A
4.06
4.83
A1
0.00
0.25
b
0.51
0.99
b2
1.14
1.78
c
0.38
0.74
c2
1.14
1.65
D
8.38
9.65
E
9.65
10.67
e
2.54 BSC
H
14.61
15.88
L
1.78
2.79
L1
--
1.68
L2
--
1.78
L3
0.25 BSC
q
0°
8°
17
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