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AIC1190-18PY3TB 查看數據表(PDF) - Analog Intergrations

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AIC1190-18PY3TB Datasheet PDF : 19 Pages
First Prev 11 12 13 14 15 16 17 18 19
AIC1190
SOP-8 Exposed Pad PACKAGE OUTLINE DRAWING
D
EXPO SED THER M AL PAD(H eat Sink)
(BOTTOM CENTER OF PACKAGE)
D1
E1
AA
e
EH
hX45°
SEE VIEW B
A
A1
B
W ITH PLATIN G
C
BASE METAL
0.25
SECTION A-A
GAUGE PLANE
L
SEATING PLANE
S
Y
M
B
VIEW B
O
L
A
A1
B
C
Note : 1. Refer to JEDEC MS-012E.
D
2. Dimension "D" does not include mold flash, protrusions
or gate burrs. Mold flash, protrusion or gate burrs shall not
exceed 6 mil per side .
3. Dimension "E" does not include inter-lead flash or protrusions.
4. Controlling dimension is millimeter, converted inch
E
e
H
h
dimensions are not necessarily exact.
L
q
D1
E1
SOP-8 Exposed Pad(Heat Sink)
MILLIMETERS
MIN.
MAX.
1.35
1.75
0.00
0.15
0.31
0.51
0.17
0.25
4.80
5.00
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.27
1.5
3.5
1.0
2.55
Note:
Information provided by AIC is believed to be accurate and reliable. However, we cannot assume responsibility for use of any circuitry
other than circuitry entirely embodied in an AIC product; nor for any infringement of patents or other rights of third parties that may result
from its use. We reserve the right to change the circuitry and specifications without notice.
Life Support Policy: AIC does not authorize any AIC product for use in life support devices and/or systems. Life support devices or
systems are devices or systems which, (I) are intended for surgical implant into the body or (ii) support or sustain life, and whose failure to
perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a
significant injury to the user.
19

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