AIC1384PSHTR 查看數據表（PDF） - Analog Intergrations

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AIC1384PSHTR

DDR Termination Regulator

Analog Intergrations 

AIC1384

0.01µF to 0.1µF of ceramic capacitor is

recommended.

VTT

VTT is the regulated output that is used to

terminate the bus resistor, which obtains the

ability of sinking and sourcing current while

regulating the output accurately to VDDQ/2. The

AIC1384 is designed to deliver up to ±3A peak

transient currents with excellent transient

response. The output capacitor should be large

enough to prevent an excessive voltage drop if a

transient is expected to last above the maximum

continuous current rating for a significant amount

of time. AIC1384 is able to provide large transient

output currents, yet it can’t handle for long

durations under all conditions that results from

the standard packages are not able to dissipate

the heat of the internal power loss. If large

currents are required for longer durations, ensure

that the maximum junction temperature is not

exceeded.

Capacitor Selection

The input capacitor of AIC1384 is required for

improved performance during large load

transients to prevent the input rail from dropping.

47µF aluminum electrolytic capacitors or ceramic

capacitor is recommended. If AVIN and PVIN are

separated, the 47µF capacitor should be placed

as close as possible to the PVIN. And AVIN can

bypass a 0.1uF ceramic capacitor to prevent

excessive noise.

220µF aluminum electrolytic capacitor is a

recommendation for output capacitor to improve

load transient response of VTT. And size above

22uF ceramic output capacitor is allowed to

general used for obtain small profile. The value of

ESR is determined by the acceptable maximum

current spike and the output voltage droops.

Thermal Dissipation

The AIC1384 has a thermal-limiting circuitry,

which is designed to protect the device against

overload condition. For continuous load

condition, maximum rating of junction

temperature must not be exceeded. It is

important to pay more attention in thermal

resistance. It includes junction to case, junction

to ambient. The maximum power dissipation of

AIC1384 depends on the thermal resistance of

its case and circuit board, the temperature

difference between the die junction and ambient

air, and the rate of airflow. The thermal

resistance is greatly affected by the package

used, the number of vias, the speed of airflow

and the thickness of copper. When the IC

mounting with good thermal conductivity is used,

the junction temperature will be low even when

large power dissipation applies. So the PCB

mounting pad for GND pin of AIC1384 should

provide maximum thermal conductivity to

maintain low device temperature.

The power dissipation across the device is

P = IOUT (VIN-VOUT).

The maximum power dissipation is:

PMAX = (TJ-max - TA )

Rθ JA

Where TJ-max is the maximum allowable junction

temperature (125°C), and TA is the ambient

temperature suitable in application.

Layout Considerations

1. Minimize high current ground loops. Place

the ground of the device, the input capacitor,

and the output capacitor together with short

and wide connection.

2. Connect the bottom-side pad (available in

SOP-8 Exposed Pad) to a large ground

plane. Use as much copper as possible to

decrease the thermal resistance of the

device.

3. A buried layer may be used as a heat

spreader if the large copper around the

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