AK8996 查看數據表（PDF） - Asahi Kasei Microdevices
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AK8996 Datasheet PDF : 74 Pages
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[AK8996/W]
Pin Configuration
1. Wafer Configuration
1) Die size
2) Die thickness
3) PAD size
4) PAD pitch
5) Scribe size
6) Wafer size
2.122 mm × 2.210 mm
200 µm
80 µm × 80 µm
> 275 µm
80 µm
6 inches
Pin numbers and Pad position
No. Pin Name
1 VSSO
2 VP
3 VS
4 VN
5 STBYN
6 CS
7 SCLK
8 SDI/O
X Location
(µm)
-914.8
-914.8
-914.8
-914.8
-593.2
-98.0
211.8
586.9
Y Location
(µm)
451.5
-10.3
-583.8
-863.8
-958.8
-958.8
-958.8
-958.8
No. Pin Name
9 DET
10 VSS
11 VDD
12 NC
13 VOUT
14 VO
15 PTH
16 AGND
X Location
(µm)
914.8
914.8
914.8
914.8
914.4
95.9
-336.6
-784.2
Y Location
(µm)
-778.1
-363.2
-49.2
563.9
958.8
958.8
958.8
958.8
Pad locations (Top view)
16
15
14
13
1
Y
12
2
3
4
5
X
11
(0,0)
10
9
6
7
8
2. Package Outline (UQFN16)
MS1055-E-02
VOUT 13
VO 14
PTH 15
AGND 16
8 SDI/O
7 SC LK
6 CS
5 STBYN
4
2011/12
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