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APW7073A 查看數據表(PDF) - Anpec Electronics

零件编号
产品描述 (功能)
比赛名单
APW7073A
Anpec
Anpec Electronics Anpec
APW7073A Datasheet PDF : 20 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
APW7073A
Ordering and Marking Information
APW7073A
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
K : SOP - 14
Operating Ambient Temperature Range
E : -20 to 70°C
Handling Code
TR : Tape & Reel
Assembly Material
L : Lead Free Device G : Halogen and Lead Free Device
APW7073A K :
APW7073A
XXXXX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1)
Symbol
Parameter
Rating
Unit
VCC, VPVCC
VBOOT
VUGATE
VLGATE
VPHASE
VCC, PVCC to GND
BOOT to PHASE
UGATE to PHASE <400ns pulse width
>400ns pulse width
LGATE to PGND <400ns pulse width
>400ns pulse width
PHASE to GND <400ns pulse width
>400ns pulse width
-0.3 to +16
V
-0.3 to +16
V
-5 to VBOOT +5
V
-0.3 to VBOOT +0.3
-5 to VPVCC +5
V
-0.3 to VPVCC +0.3
-10 to +30
V
-0.3 to 16
VRT, VOCSET, VEN
VFB, VCOMP, VSS
VPGND
TJ
TSTG
TSDR
RT, OCSET, EN to GND
FB, COMP, SS to GND
PGND to GND
Junction Temperature Range
Storage Temperature
Maximum Lead Soldering Temperature, 10 Seconds
-0.3 to VCC+0.3
V
-0.3 to 7
V
-0.3 to +0.3
V
-20 to 150
°C
-65 to 150
°C
260
°C
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under
"recommended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.
Thermal Characteristics (Note 2)
Symbol
θJA
Parameter
Junction-to-Ambient Thermal Resistance in Free Air
SOP-14
Typical Value
160
Unit
oC/W
Note2: θJA is measured with the component mounted on a high effective the thermal conductivity test board in free air. The
exposed pad of package is soldered directly on the PCB.
Copyright © ANPEC Electronics Corp.
2
Rev. A.5 - Nov., 2012
www.anpec.com.tw

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