BD2202G(2009) 查看數據表（PDF） - ROHM Semiconductor
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BD2202G Datasheet PDF : 13 Pages
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BD2202G,BD2206G
Technical Note
Application information
When an excessive current flows because of an output short circuit, a noise caused by the inductance of power supply to the
IC breaks out and it is possible that it influences negatively the IC operation. In order to avoid this problem, please connect
CIN bypass capacitor close to the IC VIN and GND pins of the IC. More than 1µF is recommended.
Due to the internal body diode in the switch, a CIN greater than COUT is highly recommended.
This system connection diagram does not guarantee operation as an application.
The external circuit constant and so on is changed and it uses, in which there are adequate margins by taking into account
external parts or dispersion of IC including not only static characteristics but also transient characteristics.
Power dissipation characteristics
(SSOP5)
800
700
600
500
400
300
200
100
0
0
25
50
75
100
125
150
AMBIENT TEMPERATURE : Ta [℃]
Fig.43 Power dissipation curve (Pd-Ta Curve)
Notes for use
(1) Absolute Maximum Ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. If any
special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physical safety
measures including the use of fuses, etc.
(2) Operating conditions
These conditions represent a range within which characteristics can be provided approximately as expected. The
electrical characteristics are guaranteed under the conditions of each parameter.
(3) Reverse connection of power supply connector
The reverse connection of power supply connector can break down ICs. Take protective measures against the breakdown due
to the reverse connection, such as mounting an external diode between the power supply and the IC’s power supply terminal.
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10/12
2009.05 - Rev.A
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