G910T84T 查看數據表（PDF） - Global Mixed-mode Technology Inc
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G910T84T Datasheet PDF : 9 Pages
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Global Mixed-mode Technology Inc.
G910/G911
Absolute Maximum Ratings
(Note 1)
Input Voltage………………………………………….10V
Power Dissipation Internally Limited
(Note2)
Maximum Junction Temperature…………………150°C
Storage Temperature Range..……-65°C ≤ TJ ≤+150°C
Lead Temperature, Time for Wave Soldering
SOT89, SOT223, µTO92 Package……..…...260°C, 4s
SCOonTti8n9u(o1u)…s …Po…w…er…Di…ss…ipa…ti…on…(T.…A =…+…2…5°…C)……..0.5W
SOT 223(1)……………………….……………………0.8W
µTO 92 & TO 92 (1)…………….……………………..0.5W
Operating Conditions
(Note 1)
Input Voltage…………………………..…..………4V ~ 7V
Temperature Range………………….….0°C ≤ TJ ≤125°C
Note (1): See Recommended Minimum Footprint.
Electrical Characteristics
VIN =5V, IO = 400mA/250mA+, CIN=10µF, COUT =10µF. All specifications apply for TA = TJ = 25°C.[Note 3]
PARAMETER
CONDITIONS
Output Voltage
5mA < IO <400mA
5mA < IO <250mA+
Line Regulation
Load Regulation
4V < VIN < 7V, IO = 10mA
10mA < IO < 400mA
10mA < IO <250mA+
Output Impedance
Quiescent Current
Ripple Rejection
Dropout Voltage
Output Current
100mA DC and 100mA AC, fO = 120Hz
VIN = 5V
fi = 120 Hz, 1VP-P, Io = 100mA
IO = 400mA
IO =250mA+
IO = 50mA
Continuous Test
TA = 25°C, TJ < 125°C,
VOUT within ±2% (Note 2)
VIN = 4.5V, mounted on SOT 89 rec-
ommended minimum footprint
VIN = 5.2V, µTO 92 & TO 92 package
0.53 inch leads soldered to PC Board
Short Circuit Current
Over Temperature
[+ for µTO-92 & TO-92 Package]
MIN
3.234
TYP
3.3
10
42
28
102
0.6
42
0.65
0.35
50
400
250+
0.77
125
MAX UNITS
3.366
V
30
mV
60
45
mV
mΩ
mA
dB
V
100
mV
mA
A
°C
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are
conditions under which the device functions but the specifications might not be guaranteed. For guaranteed speci-
fications and test conditions see the Electrical Characteristics.
Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resis-
tance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is
Tjmax-TA / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal
shutdown. For the G910 in SOT 89 package & µTO 92,TO 92, θJA is 250°C/W and in the SOT-223 package is
156°C/W (See Recommended Minimum Footprint). The safe operation in SOT 89,µTO 92,TO 92 & SOT 223
package, it can see “Typical Performance Characteristics” (Safe Operating Area).
Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Note4: The type of output capacitor should be tantalum or aluminum.
Definitions
Dropout Voltage
The input/output Voltage differential at which the regu-
lator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100mV below its nominal value, dropout
voltage is affected by junction temperature, load cur-
rent and minimum input supply requirements.
Line Regulation
The change in output voltage for a change in input volt-
age. The measurement is made under conditions of low
dissipation or by using pulse techniques such that av-
erage chip temperature is not significantly affected.
Load Regulation
The change in output voltage for a change in load
current at constant chip temperature. The measure-
ment is made under conditions of low dissipation or by
using pulse techniques such that average chip tem-
perature is not significantly affected.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Quiescent Bias Current
Current which is used to operate the regulator chip
and is not delivered to the load.
Ver: 6.6
Sep 25, 2002
TEL: 886-3-5788833
http://www.gmt.com.tw
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